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  Datasheet File OCR Text:
 ZMD-Standard
November 1995
Package SOP20 (300 mil)
MDS 727
Supersedes Edition 01.95
Dimensions in millimetres Based on IEC 191-2Q: Type 075E04 B 1 Dimensions X A2 A View X
k x 45
0,1
20
A1
1 Z
e D
b
0,2 M
Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2,65 0,35 0,49 1,27 10,00 10,65 0,40 0,81
HE
E
Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* 2,35 0,10 0,30 2,25 2,45 0,23 0,32 12,60 13,00 7,40 7,60 0,25 0 8
* without mold-flash
2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form
0,55 g Low Stress Epoxy
Emin* Emax* kmin qmin qmax
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Zentrum Mikroelektronik Dresden GmbH Editor: signed Schoder Check signed Wlde: Date: 13.11.1995 Quality: signed Lorenz Doc-No. QS-000727-HD-02
Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten.
Proprietary data, company confidential. All rights reserved.
c
LP
G


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